CAJ | 학술논문

静电防护(ESD)测试是半导体集成电路可靠性的重要项目,存在ESD问题会对产品的可靠性造成致命的影响.而由于目前产品的ESD测试,必须经过成品封装后才能进行,这样就无法快速进行产品的ESD认证和评估.介绍了ESD测试中如何利用陶瓷双列直插式封装(ceramic DIP或sB)来快速实现产品的ESD测试.对于一些多管脚芯片产品,举例说明了一种共地连接、分组测试的方法,克服了该封装有管脚数量限制的局限性.该方法简单、低成本、并且可以快速完成.可以极大地减少相对于传统ESD评估或认证的时间和成本,随之也大大缩短了产品的研发认证周期.
정전방호(ESD)측시시반도체집성전로가고성적중요항목,존재ESD문제회대산품적가고성조성치명적영향.이유우목전산품적ESD측시,필수경과성품봉장후재능진행,저양취무법쾌속진행산품적ESD인증화평고.개소료ESD측시중여하이용도자쌍렬직삽식봉장(ceramic DIP혹sB)래쾌속실현산품적ESD측시.대우일사다관각심편산품,거례설명료일충공지련접、분조측시적방법,극복료해봉장유관각수량한제적국한성.해방법간단、저성본、병차가이쾌속완성.가이겁대지감소상대우전통ESD평고혹인증적시간화성본,수지야대대축단료산품적연발인증주기.
ESD (electro static discharge) test is an important item in IC reliability. It is lethal for a product with potential ESD concern. Currently, since the ESD test cannot be done until the chips are assembled, this brings difficulties on timely ESD qualifications and evaluations. The ESD tests were introduced using a ceramic DIP carrier (called "side-braze", SB) to realize earlier evaluations. For high pin-count products, some cases were illustrated using common ground connection and separating the ESD tests to overcome the limitations on SB available leads. The proposed solution is simple, cost effective, and can be done much quicker. It greatly reduces the time and investment on the traditional ESD qualifications and evaluations leading to a much shortened cycle on product development.