CAJ | 학술논문

利用四点弯曲实验测试了一组芯片(30片)的强度,使用威布尔统计模型描述了芯片失效率的分布,预测了在后续热循环过程中芯片的失效概率.通过有限元软件研究了底充胶固化工艺对芯片上方垂直开裂应力、焊点等效塑性应变及低k层最大等效应力的影响.结果表明:与未经固化的相比,底充胶固化工艺使得芯片的失效率从0.08%增大到0.37%,焊点的等效塑性应变增大约7倍,低k层的最大等效应力增大约18%.
이용사점만곡실험측시료일조심편(30편)적강도,사용위포이통계모형묘술료심편실효솔적분포,예측료재후속열순배과정중심편적실효개솔.통과유한원연건연구료저충효고화공예대심편상방수직개렬응력、한점등효소성응변급저k층최대등효응력적영향.결과표명:여미경고화적상비,저충효고화공예사득심편적실효솔종0.08%증대도0.37%,한점적등효소성응변증대약7배,저k층적최대등효응력증대약18%.
The strength for a set of dies (the number of dies is 30) was tested by the four-point bending test.Weibull statistical model was used to describe the distribution of the die failure probability, and the die failure probability during subsequent thermal cycling was predicted.The effects of the curing process of the underfill on the vertical crack stress on top of the die, maximum equivalent stress of the low-k layer and equivalent plastic stain of the solder joint were investigated by finite element software.The results show that the die failure probability is increased from 0.08% to 0.37%, the equivalent plastic stain of the solder joint is increased by about 7 times than that without considering curing process, and the maximum equivalent stress of the low-k layer is increased by about 18% due to the curing process of the underfill.