现代显示
現代顯示
현대현시
ADVANCED DISPLAY
2012年
1期
35-39
,共5页
LED%背光模组%热管理%数据处理
LED%揹光模組%熱管理%數據處理
LED%배광모조%열관리%수거처리
LED%backlighting module%thermal analysis%data analysis
文章建立了RGB三合一LED背光模组的热分析模型,通过与红外热像仪实际测量得到的温度数据相互比较,验证了该模型仿真结果的准确性。模拟分析的结果表明,在LED阵列底部固定一块镀锌钢板可有效降低LED结温。文章还提出了一种利用最小二乘法原理推算LED结点温度的方法,得到了电路板表面温度与LED结温之间的关系式,有助于通过测量电路板温度估算LED的结点温度,并以此为根据对LED进行亮度和色度的调节。
文章建立瞭RGB三閤一LED揹光模組的熱分析模型,通過與紅外熱像儀實際測量得到的溫度數據相互比較,驗證瞭該模型倣真結果的準確性。模擬分析的結果錶明,在LED陣列底部固定一塊鍍鋅鋼闆可有效降低LED結溫。文章還提齣瞭一種利用最小二乘法原理推算LED結點溫度的方法,得到瞭電路闆錶麵溫度與LED結溫之間的關繫式,有助于通過測量電路闆溫度估算LED的結點溫度,併以此為根據對LED進行亮度和色度的調節。
문장건립료RGB삼합일LED배광모조적열분석모형,통과여홍외열상의실제측량득도적온도수거상호비교,험증료해모형방진결과적준학성。모의분석적결과표명,재LED진렬저부고정일괴도자강판가유효강저LED결온。문장환제출료일충이용최소이승법원리추산LED결점온도적방법,득도료전로판표면온도여LED결온지간적관계식,유조우통과측량전로판온도고산LED적결점온도,병이차위근거대LED진행량도화색도적조절。
This paper presents a thermal design of the light emitting diode (LED) with 3 chips and its array. The accuracy of the module is verified though a comparison with actual data which is measured by the infrared thermograph. The simulation results show that adding a galvanized steel sheet helps reduce the junction temperature of LEDs. In addition, a method to reckon the junction temperature of LEDs using least square method is studied to calculate the relationship between the temperature of circuit board surface and the junction temperature of LEDs, which contributes to adjust the luminance and chromaticity in real time.