CAJ | 학술논문

流体点胶是一种以受控的方式对流体进行精确分配的过程，它是微电子封装行业的关键技术之一。目前，点胶技术逐渐由接触式点胶向无接触式（喷射）点胶技术转变。从微电子封装过程的应用出发，对点胶技术的发展进行了概述；在对比各种点胶方式的同时，重点介绍了无接触式喷射点胶技术，以及其中所涉及的关键技术，并提出了评价点胶品质的标准。
류체점효시일충이수공적방식대류체진행정학분배적과정，타시미전자봉장행업적관건기술지일。목전，점효기술축점유접촉식점효향무접촉식（분사）점효기술전변。종미전자봉장과정적응용출발，대점효기술적발전진행료개술；재대비각충점효방식적동시，중점개소료무접촉식분사점효기술，이급기중소섭급적관건기술，병제출료평개점효품질적표준。
Fluid dispensing is a process to dispensing the fluid accurately in a controlled manner,it is one of the key technologies of microelectronics packaging. At present, there is an evolution in the fluid dispensing technology for applying fluids from contact methods to non-contact methods, such evolution will bring a great change for the dispensing industry. Based on the applications of dispensing technology in microelectronics packaging processes, dispensing technical development process was overviewed. Contrasting the features and performances of various methods, the non-contact jetting technology was mainly highlighted,including its key technologies and the evaluation standard of dispensing quality.