CAJ | 학술논문

目前电子制造业界把低成本的低Ag无铅焊料合金定义为第二代无铅焊料合金。在目前已公开的第二代无铅低Ag焊料合金类型中,又以掺入微量Co改性的应用性能和可靠性表现最优秀而受到了关注。重点对该类型焊料合金掺Co改性的机理展开了研究试验。在研究试验结论的基础上,分析了其推广应用的良好前景。
목전전자제조업계파저성본적저Ag무연한료합금정의위제이대무연한료합금。재목전이공개적제이대무연저Ag한료합금류형중,우이참입미량Co개성적응용성능화가고성표현최우수이수도료관주。중점대해류형한료합금참Co개성적궤리전개료연구시험。재연구시험결론적기출상,분석료기추엄응용적량호전경。
At present,lead-free low-Ag solder alloy,which is low-cost,is defined as the second generation of lead-free solder alloy in the electronics manufacturing industry.Among the second generation of lead-free low-Ag solder alloy type,the solder alloy doping a Little cobalt is paid wide attention because it shows the best performance and reliability.Focuses on the type of the doping cobalt solder alloy and make a study of the mechanism which advance the performance.On the basis of the conclusion of researched test the type solder has a good prospect of wide application.