上海大学学报（英文版）
上海大學學報（英文版）
상해대학학보（영문판）
JOURNAL OF SHANGHAI UNIVERSITY (ENGLISH EDITION)
2007年
1期
1-16
,共16页
刘建影%路秀真%曹立强
劉建影%路秀真%曹立彊
류건영%로수진%조립강
electronics packaging%anisotropic conductive adhesives%reliability
Anisotropic conductive adhesive technology for electronics packaging and interconnect application has significantly been developed during the last few years. It is time to make a summary of what has been done in this field. The present paper reviews the technology development, especially from the reliability point of view. It is pointed out that anisotropic conductive adhesives are now widely used in many applications and the reliability data and models have been developed to a large extent for anisotropic conductive adhesives in various applications.
