电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2010年
2期
54-55,61
,共3页
曹贵川%林祖伦%祁康成%王小菊
曹貴川%林祖倫%祁康成%王小菊
조귀천%림조륜%기강성%왕소국
氧化钪%钡钨阴极%钨粉%掺杂
氧化鈧%鋇鎢陰極%鎢粉%摻雜
양화항%패오음겁%오분%참잡
scandium oxide%Ba-W cathodes%tungsten powder doping
采用液-固掺杂工艺,以Sc(NO_3)_3水溶液制备了Sc_2O_3掺杂的钨粉,研究了所获钨粉的形貌、Sc_2O_3的分布.扫描电镜显示掺杂钨粉颗粒表面和裂缝中均匀附着了Sc_2O_3粉末,选区能谱分析证明Sc_2O_3在钨颗粒的表面覆盖均匀.Sc_2O_3与钨接触面增多,增大了钪与钨的结合力,该掺杂钨粉能够用于制备热电子发射均匀、抗离子轰击能力强的含钪钡钨阴极.
採用液-固摻雜工藝,以Sc(NO_3)_3水溶液製備瞭Sc_2O_3摻雜的鎢粉,研究瞭所穫鎢粉的形貌、Sc_2O_3的分佈.掃描電鏡顯示摻雜鎢粉顆粒錶麵和裂縫中均勻附著瞭Sc_2O_3粉末,選區能譜分析證明Sc_2O_3在鎢顆粒的錶麵覆蓋均勻.Sc_2O_3與鎢接觸麵增多,增大瞭鈧與鎢的結閤力,該摻雜鎢粉能夠用于製備熱電子髮射均勻、抗離子轟擊能力彊的含鈧鋇鎢陰極.
채용액-고참잡공예,이Sc(NO_3)_3수용액제비료Sc_2O_3참잡적오분,연구료소획오분적형모、Sc_2O_3적분포.소묘전경현시참잡오분과립표면화렬봉중균균부착료Sc_2O_3분말,선구능보분석증명Sc_2O_3재오과립적표면복개균균.Sc_2O_3여오접촉면증다,증대료항여오적결합력,해참잡오분능구용우제비열전자발사균균、항리자굉격능력강적함항패오음겁.
Sc_2O_3-doped tungsten powders were prepared by liquid-solid doping method, using the Sc(NO_3)_3 solution as precursor.The morphology of the obtained tungsten powders and distribution of Sc_2O_3 were tested by SEM and energy dispersive spectrometry(EDS).The results show that Sc_2O_3 powders are distributed uniformly on the surface of tungsten powder particle and the cracks of the powders.In addition, the adhesion between scandium and tungsten is highly improved due to the increased interface.The doped tungsten powders can be used for the preparation of scandia-doped Ba-W cathodes with uniform thermionic emission and excellent mechanical stability against ion bombardment.