CAJ | 학술논문

印制电路板的散热效果直接影响高频多功能电子产品的可靠性。基于混压高频子板的多层印制电路板,其散热性能受到设计、制造材料与工艺的限制。本文简述了大功率元器件引发高频混压多层板的热问题,探讨了高频混压多层板散热方法及其局限,提出改善高频混压多层板散热性能的有效方法。
인제전로판적산열효과직접영향고빈다공능전자산품적가고성。기우혼압고빈자판적다층인제전로판,기산열성능수도설계、제조재료여공예적한제。본문간술료대공솔원기건인발고빈혼압다층판적열문제,탐토료고빈혼압다층판산열방법급기국한,제출개선고빈혼압다층판산열성능적유효방법。
The reliability of high frequency（HF） and multifunction electronic products were directly affected by the thermal property of PCB.The thermal effects of HF Mixed-Laminated multilayer PCB could be confined with the design,materials and manufacturing processes.The thermal problems of HF Mixed-Laminated multilayer PCB could be induced by electronic large-power components.Traditional thermal dissipation was so limited in HF Mixed-Laminated multilayer PCB that the improvement of heat dissipation was introduced.