CAJ | 학술논문

报道了一种基于CMOS工艺接收电路芯片和GaAs工艺1×12光电探测器阵列的30Gbit/s并行光接收模块.该模块采用并行光通信方案,利用中高速光电子器件实现信号的高速传输.直接使用未经封装的接收电路裸片和光探测器裸片,采用电路板上芯片技术封装制作模块,并通过倒装焊的方式实现了探测器阵列与列阵光纤的精确对准并形成了可插拔的光接口.测试结果表明模块的接收能力可以达到30Gbit/s.误码率小于10-13时,接收模块的灵敏度可以达到-13.6dBm.
보도료일충기우CMOS공예접수전로심편화GaAs공예1×12광전탐측기진렬적30Gbit/s병행광접수모괴.해모괴채용병행광통신방안,이용중고속광전자기건실현신호적고속전수.직접사용미경봉장적접수전로라편화광탐측기라편,채용전로판상심편기술봉장제작모괴,병통과도장한적방식실현료탐측기진렬여렬진광섬적정학대준병형성료가삽발적광접구.측시결과표명모괴적접수능력가이체도30Gbit/s.오마솔소우10-13시,접수모괴적령민도가이체도-13.6dBm.
A 30Gbit/s receptor module is developed with a CMOS integrated receiver chip(IC) and a GaAs-based 1 × 12 photo detector array of PIN-type. Parallel technology is adopted in this module to realize a high-speed receiver module with medium speed devices. A high-speed printed circuit board(PCB) is designed and produced. The IC chip and the PD array are packaged on the PCB by chip-on-board technology. Flip chip alignment is used for the PD array accurately assembled on the module so that a plug-type optical port is built. Test results show that the module can receive parallel signals at 30Gbit/s. The sensitivity of the module is - 13.6dBm for 10-13BER.