CAJ | 학술논문

研究了熔渗温度、退火温度及退火冷却速度对W-15Cu电子封装材料导热性能的影响,试验结果表明退火能改善W-15Cu电子封装材料的导热性能,经850℃退火随炉冷的导热性能稳定在190W/(m*K)左右;W-15Cu电子封装材料界面残余应力的大小是影响材料导热性能的重要因素之一,残余应力越大,材料导热性能越差;W-15Cu电子封装材料随熔渗温度升高,导热系数增加,熔渗温度在1 400℃时的导热性能最好.
연구료용삼온도、퇴화온도급퇴화냉각속도대W-15Cu전자봉장재료도열성능적영향,시험결과표명퇴화능개선W-15Cu전자봉장재료적도열성능,경850℃퇴화수로랭적도열성능은정재190W/(m*K)좌우;W-15Cu전자봉장재료계면잔여응력적대소시영향재료도열성능적중요인소지일,잔여응력월대,재료도열성능월차;W-15Cu전자봉장재료수용삼온도승고,도열계수증가,용삼온도재1 400℃시적도열성능최호.
The effects of infiltrating temperature, annealing temperature and the cooling speed of annealing process on the property of thermal conductivity (TC) of W-15Cu heat sink were carefully investigated in this paper. The results show that: the value of thermal conductivity can be obviously improved after annealing process. The residual stresses plays a key role on the TC of W-15Cu which is reduced with the increase of the residual stresses. At the same time, TC is increased when increasing the infiltrating temperature.