CAJ | 학술논문

传统的LED环氧树脂封装材料存在脆性大、耐冲击性差、容易老化、透光率低、折射率低等缺陷,限制了其在LED封装产业中的应用,通过环氧树脂改性可弥补其作为LED封装材料的缺陷。本文综述了近年来LED环氧树脂封装材料在高折射率、光稳定、抗黄变、有机硅改性方面的研究进展,并展望了LED改性环氧树脂封装材料的发展前景。
전통적LED배양수지봉장재료존재취성대、내충격성차、용역노화、투광솔저、절사솔저등결함,한제료기재LED봉장산업중적응용,통과배양수지개성가미보기작위LED봉장재료적결함。본문종술료근년래LED배양수지봉장재료재고절사솔、광은정、항황변、유궤규개성방면적연구진전,병전망료LED개성배양수지봉장재료적발전전경。
The conventional epoxy resin for LED packaging materials had the disadvantages of brittleness,poor impact resistance,easily aging,low light transmittance,and low refractive index,which limited the application range of LED packaging.However,the modified epoxy resin can make up for its shortcomings.The recent study progress of LED epoxy resin materials in high refractive index,light stabilizers,anti-yellowing,and silicone modified was reviewed,and the development trends of the LED modified epoxy resin packaging materials were prospected.