固-液金属界面上金属间化合物的非平衡生长
고-액금속계면상금속간화합물적비평형생장
Nonequilibrium Growth of Intermetallics at the Interface of Liquid solid Metal
  • 万方数据
    物理化学学报 물이화학학보
    ACTA PHYSICO-CHIMICA SINICA
    2001年 5期 453-456 ,共4页

    劳邦盛%高苏%张启运

    로방성%고소%장계운

    金属间化合物%界面反应%钎焊 金屬間化閤物%界麵反應%釬銲
    금속간화합물%계면반응%천한


    The growth characteristic of intermetallics during the reaction of solid (Cu,Ag,Au,Fe,Co,Ni,etc) with liquid (Sn,Sb,Bi,Zn) within a very short time of 1～ 2 s at different temperatures has been studied by metallographic method for explaining the process in the fillet during soldering. It is indicated that the incongruent compourds often grow up as bamboo shoot form. But congruent compounds grow up basically just by spreading out as a layer along the solid border. Base on these facts,the influence of intermetallics in the fillet during soldering has been discussed.
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