CAJ | 학술논문

为推动激光焊接技术在行业中的普及应用,文中简要介绍了激光焊接技术的特点,总结了激光焊接技术在电子封装领域（如电池制造、微波组件封装等）中的研究和应用现状,介绍了激光焊接数值模拟方面的进展,并指出了YAG激光焊接技术目前存在的问题及未来的发展趋势。研究表明,激光焊接已成为目前电子封装行业中最受欢迎的焊接技术之一,而且随着激光焊接系统的发展,激光焊接技术将具有更加广阔的应用前景。
위추동격광한접기술재행업중적보급응용,문중간요개소료격광한접기술적특점,총결료격광한접기술재전자봉장영역（여전지제조、미파조건봉장등）중적연구화응용현상,개소료격광한접수치모의방면적진전,병지출료YAG격광한접기술목전존재적문제급미래적발전추세。연구표명,격광한접이성위목전전자봉장행업중최수환영적한접기술지일,이차수착격광한접계통적발전,격광한접기술장구유경가엄활적응용전경。
To popularize the laser welding technology in the industry,the characteristics of laser welding technology are introduced,the study and applications of laser welding in electronic packaging industry,such as manufacture of battery cell and packaging of microwave module,are summarized and the development of numerical simulation of laser welding process is introduced in this paper.Besides,the existing problems and the development trend of YAG laser welding technology are pointed out.The study shows that laser welding has been one of the most popular technology in electronic packaging industry and it will be used more and more widely with the development of laser welding system.