CAJ | 학술논문

介绍了用2个电极通过一次电极反接的方式实现多层样片之间阳极键合的操作工艺和键合机理,并以玻璃-硅-玻璃三层结构为例对其进行了实验研究.结果显示:多余的玻璃对第一次键合过程的电流特性影响不大,而第一次键合的玻璃对第二次键合电流产生显著的影响,电流出现不规则的突变.而且,在第二次键合过程中,第一次键合的玻璃在键合面上会出现由于钠元素积聚而产生的黄褐色斑点.拉伸强度实验的结果表明:第二次键合过程中在第一次键合面形成的反向电压会减弱键合的强度;通过合理选择键合参数可以得到满足MEMS封装要求的键合强度.
개소료용2개전겁통과일차전겁반접적방식실현다층양편지간양겁건합적조작공예화건합궤리,병이파리-규-파리삼층결구위례대기진행료실험연구.결과현시:다여적파리대제일차건합과정적전류특성영향불대,이제일차건합적파리대제이차건합전유산생현저적영향,전류출현불규칙적돌변.이차,재제이차건합과정중,제일차건합적파리재건합면상회출현유우납원소적취이산생적황갈색반점.랍신강도실험적결과표명:제이차건합과정중재제일차건합면형성적반향전압회감약건합적강도;통과합리선택건합삼수가이득도만족MEMS봉장요구적건합강도.
Multi-stack anodic bonding using two electrodes is realized. Experimental study is performed based on glass-silicon-glass triple-stack structure. As one of the results the additional glass rarely influences on the first bonding but the first bonded glass influences on the second bonding as there are irregularly current breaks. Sodium clustering induced yellow-brown points appears on the second anodic bonding. Strength testing results show that reversal potential during the second bonding between the first bonding interface makes the strength on the first bonded interface worse,but this bonding method is still fit for MEMS package under optical parameters.