CAJ | 학술논문

PCB和CCL行业的高速发展,对作为其基础材料的铜箔提出了更多要求。铜箔必须同时满足PCB和CCL的多项性能要求,这给铜箔生产商带来了严峻的技术挑战和难得的发展机遇。从铜箔生产制成控制原理、方法和实际管控等方面,讨论铜箔如何应对CCL和PCB高度发展要求。
PCB화CCL행업적고속발전,대작위기기출재료적동박제출료경다요구。동박필수동시만족PCB화CCL적다항성능요구,저급동박생산상대래료엄준적기술도전화난득적발전궤우。종동박생산제성공제원리、방법화실제관공등방면,토론동박여하응대CCL화PCB고도발전요구。
As basic materials,copper foils are proposed more requests with rapid development of PCB and CCL industry.In order to meet many performance requirements at the same time,the manufacturers of copper foils are faced with rigorous challenge of technologies and precious development opportunities.In this paper,the production process of copper foils,including control principle,method and actual control and so on,are discussed to meet the requests of rapid development of PCB and CCL industry.