计算机工程与科学
計算機工程與科學
계산궤공정여과학
COMPUTER ENGINEERING & SCIENCE
2009年
z1期
5-7,13
,共4页
背板%信号完整性%印制板材料%连接器%过孔%高速串行传输
揹闆%信號完整性%印製闆材料%連接器%過孔%高速串行傳輸
배판%신호완정성%인제판재료%련접기%과공%고속천행전수
backplane%signal integrity%PCB material%connector%via%SERDES
高性能计算机和通信系统的互连传输速率超过10Gbps,信号频谱高端已达数10GHz(MGH)以上.本文分析了MGH背板的互连方式,讨论了高性能PCB板材和连接器的性能和应用能力.针对MGH背板高速率串行传输的信号完整性设计要求,提出采用小角度布线、反钻和双直径过孔的设计技术,并在工程设计中得到了成功应用.
高性能計算機和通信繫統的互連傳輸速率超過10Gbps,信號頻譜高耑已達數10GHz(MGH)以上.本文分析瞭MGH揹闆的互連方式,討論瞭高性能PCB闆材和連接器的性能和應用能力.針對MGH揹闆高速率串行傳輸的信號完整性設計要求,提齣採用小角度佈線、反鑽和雙直徑過孔的設計技術,併在工程設計中得到瞭成功應用.
고성능계산궤화통신계통적호련전수속솔초과10Gbps,신호빈보고단이체수10GHz(MGH)이상.본문분석료MGH배판적호련방식,토론료고성능PCB판재화련접기적성능화응용능력.침대MGH배판고속솔천행전수적신호완정성설계요구,제출채용소각도포선、반찬화쌍직경과공적설계기술,병재공정설계중득도료성공응용.
The transmit rates of SERDES have approached 10 Gbps in high performance computer and telecom system,the high-end of frequency spectra in the serial links even reached over Multi-GigaHertz. This article has discussed the link method on MGH backplane. The key parameters and the application of high-performance printed circuit board (PCB) materials and backplane connectors have been presented. For achieving reliable transmission and signal integrity in the design of MGH backplane, this article proposes the angled (or zigzag) routing method, as well as the technoques of backdrilling via and dual diameter via,and these techniques have been successful applied in practical project.
