CAJ | 학술논문

对目前国内外电子组装用低银无铅焊料最新的研究和应用情况进行了回顾和评述,介绍了低银无铅焊料的现状和其可靠性问题,以及国内外对几种低银无铅焊料进行的研究情况,最后着重分析和展望了低银无铅焊料研究应用的主要发展方向和趋势.
대목전국내외전자조장용저은무연한료최신적연구화응용정황진행료회고화평술,개소료저은무연한료적현상화기가고성문제,이급국내외대궤충저은무연한료진행적연구정황,최후착중분석화전망료저은무연한료연구응용적주요발전방향화추세.
The research advances of low-Ag lead-free solder used in electronic packaging were reviewed and commented. Properties and relability problems of low-Ag solders were introduced and commented. Moreover, the domestic and overseas development of several kinds of low Ag solders were introduced. Finally, the research and application prospects of low Ag solder were introduced.