电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2011年
6期
335-337
,共3页
MLCC分层%内浆%瓷粉%TMA%排胶%回火%氧含量
MLCC分層%內漿%瓷粉%TMA%排膠%迴火%氧含量
MLCC분층%내장%자분%TMA%배효%회화%양함량
MLCC%Delamination%Inner electrode paste%Ceramic powder%TMA%Binder burn out%Re-oxidation%Oxygen content
MLCC是经过多层材料堆叠共烧后制成的,在其制作过程中,产生分层是比较严重的质量缺陷之一,严重影响MLCC在使用过程中的可靠性。对MLCC产生分层的原因进行分析归类,总结出MLCC产生分层的原因为：制作MLCC内浆与瓷粉TMA（热机械分析）曲线匹配性不佳;MLCC在烧结前存在排胶不良;烧结回火温度或氧含量高。
MLCC是經過多層材料堆疊共燒後製成的,在其製作過程中,產生分層是比較嚴重的質量缺陷之一,嚴重影響MLCC在使用過程中的可靠性。對MLCC產生分層的原因進行分析歸類,總結齣MLCC產生分層的原因為：製作MLCC內漿與瓷粉TMA（熱機械分析）麯線匹配性不佳;MLCC在燒結前存在排膠不良;燒結迴火溫度或氧含量高。
MLCC시경과다층재료퇴첩공소후제성적,재기제작과정중,산생분층시비교엄중적질량결함지일,엄중영향MLCC재사용과정중적가고성。대MLCC산생분층적원인진행분석귀류,총결출MLCC산생분층적원인위：제작MLCC내장여자분TMA（열궤계분석）곡선필배성불가;MLCC재소결전존재배효불량;소결회화온도혹양함량고。
MLCC consists of multi layers of dielectric and metal electrodes sintering together.delamination is one of the main quality defects during the manufacturing,which has a significant effect on the reliability during the application.Classify the reasons of delamination,and find failure reasons are non-matching between ceramic dielectric and inner electrode paste,not well of binder burn out before sintering;high reoxidation temperature or high oxygen content during the sintering.
