科技导报
科技導報
과기도보
SCIENCE & TECHNOLOGY REVIEW
2010年
1期
30-34
,共5页
李玲玲%张阳德%赵劲风%李坚%崔海信%罗皓%潘一峰
李玲玲%張暘德%趙勁風%李堅%崔海信%囉皓%潘一峰
리령령%장양덕%조경풍%리견%최해신%라호%반일봉
纳米%TiO_2%光催化%离子掺杂%甲基蓝
納米%TiO_2%光催化%離子摻雜%甲基藍
납미%TiO_2%광최화%리자참잡%갑기람
nanometer%titania%photocatalysis%ion doping%methylene blue
以无机钛盐为原料,采用凝胶-溶胶法,制备二氧化钛纳米溶胶和掺入不同质量分数铜的Cu~(2+)/TiO_2纳米溶胶,对其进行表征.通过对甲基蓝光催化降解,对Cu~(2+)/TiO_2纳米溶胶和TiO_2纳米溶胶的光催化活性进行比较,考察了聚合反应时间、表面活性剂、光照时间和强度、薄膜厚度、掺入铜离子浓度等因素对TiO_2溶胶光催化活性的影响.结果表明,掺铜TiO_2纳米溶胶的光催化活性较高,光催化性能优良,铜掺杂量为0.5%时效果较好.
以無機鈦鹽為原料,採用凝膠-溶膠法,製備二氧化鈦納米溶膠和摻入不同質量分數銅的Cu~(2+)/TiO_2納米溶膠,對其進行錶徵.通過對甲基藍光催化降解,對Cu~(2+)/TiO_2納米溶膠和TiO_2納米溶膠的光催化活性進行比較,攷察瞭聚閤反應時間、錶麵活性劑、光照時間和彊度、薄膜厚度、摻入銅離子濃度等因素對TiO_2溶膠光催化活性的影響.結果錶明,摻銅TiO_2納米溶膠的光催化活性較高,光催化性能優良,銅摻雜量為0.5%時效果較好.
이무궤태염위원료,채용응효-용효법,제비이양화태납미용효화참입불동질량분수동적Cu~(2+)/TiO_2납미용효,대기진행표정.통과대갑기람광최화강해,대Cu~(2+)/TiO_2납미용효화TiO_2납미용효적광최화활성진행비교,고찰료취합반응시간、표면활성제、광조시간화강도、박막후도、참입동리자농도등인소대TiO_2용효광최화활성적영향.결과표명,참동TiO_2납미용효적광최화활성교고,광최화성능우량,동참잡량위0.5%시효과교호.
Nanometer TiO_2 and Cu~(2+)/TiO_2 composite material was prepared by the sol-gel method. During the process of preparing the antibacterial TiO_2 and Cu~(2+)/TiO_2, with various contents of Ti(SO_4)2 and copper ion, a series of TiO_2 sol and Cu~(2+)/TiO_2 sol were obtained. They were characterized with the laser diffraction particle size analyzer, XRD and TEM. The results show that the size of TiO_2 grains ranges in 3.9~97.9nm, with an effective diameter of 63.6nm and a polydispersity of 0.222. The effective diameter of Cu~(2+)/TiO_2 is 58.4nm, with the polydispersity of 0.237. The TiO_2 was anatase, and the diameter of Cu~(2+)/TiO_2 sol is slightly smaller than that of TiO_2, but the performance against photodegradation may be better than TiO_2 sol. TiO_2 and Cu~(2+)/TiO_2 are compared by the catalytic degradation of methyl blue to see the impact of the polymerize reaction time, surfactant, light source, Cu~(2+)/TiO_2 film and the concentration of copper ion on the photo-catalytic of TiO_2. Our experiments show that Cu~(2+)/TiO_2 sol has better photocatalytic activity than TiO_2 sol, with the optimal concentration of copper ion of 0.5%.