金属学报（英文版）
金屬學報（英文版）
금속학보（영문판）
ACTA METALLURGICA SINICA (ENGLISH LETTERS)
2004年
6期
876-880
,共5页
deposition%simulation%pattern formation%ballistic model
A model coupling particle aggregation and randomwalk surface diffusion has been developed for 2D simulation of depositionalgrowth, in which impinging particles follow either a straight-line trajectory of cosine distribution, representing typically sputter deposition, or a scattered trajectory, representing typically electrochemical deposition.Simulations of the growth under various impinging conditions and effective surface diffusivity have been carried out. Pattern and defect development in deposition on flat,trenched and ridged substrates have been investigated. We found that on flat and ridged substrates, both types of trajectories yield similar features, including formation of cone-like defects on surface ridges. While on trenched substrate, the straight-line impingement yielded more uniform step coverage than the scattered impingement.
