CAJ | 학술논문

软钎焊焊点界面反应是连接金属的最古老的冶金工艺过程。随着倒装芯片（FC）、球栅阵列（BGA）和芯片级封装（CSP）等面封装技术的兴起,近年来Sn基钎料被广泛应用于微电子制造,包括芯片和基板之间的封装互连以及基板与印制电路板之间的组装互连。这就需要系统地研究Sn基钎料焊点界面反应及微观组织。从形态学、热力学和动力学的角度回顾总结了SnPb共晶钎料、高Pb钎料和无Pb钎料与Cu、Ni、Au/Ni/Cu、PdAg焊盘之间的界面反应。
연천한한점계면반응시련접금속적최고로적야금공예과정。수착도장심편（FC）、구책진렬（BGA）화심편급봉장（CSP）등면봉장기술적흥기,근년래Sn기천료피엄범응용우미전자제조,포괄심편화기판지간적봉장호련이급기판여인제전로판지간적조장호련。저취수요계통지연구Sn기천료한점계면반응급미관조직。종형태학、열역학화동역학적각도회고총결료SnPb공정천료、고Pb천료화무Pb천료여Cu、Ni、Au/Ni/Cu、PdAg한반지간적계면반응。
Solder reaction is one of the oldest metallurgical processes for joining metal parts.With the development of surface packaging technology,such as FC,BGA,and CSP,the use of solder in modern microelectronic technology,that is in connecting the lead frame of a chip to a substrate and in joining the substrate to a print circuit board,is ubiquitous.For the success of the technology,it requires a systematic study of solder reaction.Reviewed solder reactions between one of the several types of Sn-based solders and one of the four pads,Cu,Ni,Au/Ni/Cu,and PdAg,on the basis of the available data of morphology,thermodynamics,and kinetics.