CAJ | 학술논문

描述了一种串联微波MEMS开关的设计、制造过程,它制作在玻璃衬底上,采用金铂触点,在DC～5GHz,插损小0.6dB,隔离度大于30dB,开关时间小于30μs.对这种微波开关的温度特性和功率处理能力进行了测试,在DC～4GHz,85℃下的插损增加了0.2dB,-55℃下的插损增加了0.4dB,而隔离度基本保持不变.在开关中流过的连续波功率从10dBm上升到35.1dBm,开关的插损下降了0.1～0.6dB,并且在35.1dBm(3.24W)下开关还能工作.和所报道的并联开关最大处理功率(420mW)相比,该结果说明串联开关具有较大的功率处理能力.
묘술료일충천련미파MEMS개관적설계、제조과정,타제작재파리츤저상,채용금박촉점,재DC～5GHz,삽손소0.6dB,격리도대우30dB,개관시간소우30μs.대저충미파개관적온도특성화공솔처리능력진행료측시,재DC～4GHz,85℃하적삽손증가료0.2dB,-55℃하적삽손증가료0.4dB,이격리도기본보지불변.재개관중류과적련속파공솔종10dBm상승도35.1dBm,개관적삽손하강료0.1～0.6dB,병차재35.1dBm(3.24W)하개관환능공작.화소보도적병련개관최대처리공솔(420mW)상비,해결과설명천련개관구유교대적공솔처리능력.
A DC to 5GHz series MEMS switch is designed and fabricated for wireless communication applications,and thermal effect and power handling of the series switch are discussed.The switch is made on glass substrate,and gold-platinum contact is used to get a stable and little insert loss.From DC to 5GHz,0.6dB insertion loss,30dB isolation,and 30μs delay are demonstrated.Thermal effect of the switch is tested in 85℃ and－55℃ atmosphere separately.From DC to 4GHz,the insert loss of the switch increases 0.2dB in 85℃ and 0.4dB in－55℃,while the isolation holds the same value as that in room temperature.To measure the power handling capability of the switch,we applied a continuous RF power increasing from 10dBm to 35.1dBm with the step of 1.0dBm across the switch at 4GHz.The switch keeps working and shows a decrease of the insert loss for 0.1～0.6dB.The maximum continuous power handling (35.1dBm,about 3.24W) is higer than the reported value of shunt switch (about 420mW),which implies series switches have much better power handling capability.