印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2012年
2期
17-19,52
,共4页
薄芯厚铜%厚度%铜箔轮廓%耐电压
薄芯厚銅%厚度%銅箔輪廓%耐電壓
박심후동%후도%동박륜곽%내전압
CCL with thin base material and thick copper foil%thickness%copper weight%the roughness of copper foil%Hi-pot
研究了厚铜箔轮廓、Rz轮廓等参数对薄芯覆铜板的厚度、耐电压等性能的影响,并针对各因素进行了相应试验和改进,可有效改善薄芯厚铜覆铜板相关性能。
研究瞭厚銅箔輪廓、Rz輪廓等參數對薄芯覆銅闆的厚度、耐電壓等性能的影響,併針對各因素進行瞭相應試驗和改進,可有效改善薄芯厚銅覆銅闆相關性能。
연구료후동박륜곽、Rz륜곽등삼수대박심복동판적후도、내전압등성능적영향,병침대각인소진행료상응시험화개진,가유효개선박심후동복동판상관성능。
This article researches on the weight and roughness of thick cooper foil which affects the thickness and electrical resistance of the CCL with thin base material and thick copper foil,and makes experiment and improvement on those factors that improves the performance.
