CAJ | 학술논문

文章介绍了以硫酸／硫酸钯作为印制电路铜箔化学镀镍的活化液。考察了表面活性剂的用量、活化时闻及活化温度对化学镀镍的影响，确定了最佳的工艺参数。并对经该活化液活化的铜箔进行化学镀镍，通过扫描电镜（SEM）对化学镀镶层的微观形貌进行表征，同时考察了该镍层的钎焊性。研究结果表明，该活化液适用于印制电路铜箔的化学镀镍前活化。
문장개소료이류산／류산파작위인제전로동박화학도얼적활화액。고찰료표면활성제적용량、활화시문급활화온도대화학도얼적영향，학정료최가적공예삼수。병대경해활화액활화적동박진행화학도얼，통과소묘전경（SEM）대화학도양층적미관형모진행표정，동시고찰료해얼층적천한성。연구결과표명，해활화액괄용우인제전로동박적화학도얼전활화。
H2SO4/PdSO4 solution was used to catalyze PCB copper circuit before electroless nickel plating. Influence of surfactant, catalyzing time and temperature on electroless nickel plating were investigated. And the technical parameter was confirmed. Electroless nickel plating was performed on the activated copper, the micro morphology of deposits was represented by S EM, and the solder ability of the deposits was also tested. The results indicated that the activation solution was applicable to the copper foil of printed circuit board.