电镀与涂饰
電鍍與塗飾
전도여도식
ELECTROPLATING & FINISHING
2010年
1期
1-4,8
,共5页
胡飞%吴坚强%黄敏%江毅
鬍飛%吳堅彊%黃敏%江毅
호비%오견강%황민%강의
镍%碳化硅%复合电沉积%脉冲电流%建模
鎳%碳化硅%複閤電沉積%脈遲電流%建模
얼%탄화규%복합전침적%맥충전류%건모
nickel%silicon carbide%composite electrodeposition%pulse current%modeling
在Guglielmi模型的基础上,推导了采用方形、上三角形、下三角形和锲形四类脉冲波形复合电沉积时,电流与镀层中惰性微粒体积分数的数学关系,并以Ni-SiC复合电沉积为例,进行了试验验证.结果表明,在相同峰值电流密度下,方波脉冲电流下SiC的沉积量是其他三类脉冲电流波形的1.51倍:而当平均电流密度相同时,方波脉冲电流下SiC的沉积量是其他三类电流波形的1.06倍.分析了电流密度对镍基体上SiC沉积量的影响.
在Guglielmi模型的基礎上,推導瞭採用方形、上三角形、下三角形和鍥形四類脈遲波形複閤電沉積時,電流與鍍層中惰性微粒體積分數的數學關繫,併以Ni-SiC複閤電沉積為例,進行瞭試驗驗證.結果錶明,在相同峰值電流密度下,方波脈遲電流下SiC的沉積量是其他三類脈遲電流波形的1.51倍:而噹平均電流密度相同時,方波脈遲電流下SiC的沉積量是其他三類電流波形的1.06倍.分析瞭電流密度對鎳基體上SiC沉積量的影響.
재Guglielmi모형적기출상,추도료채용방형、상삼각형、하삼각형화계형사류맥충파형복합전침적시,전류여도층중타성미립체적분수적수학관계,병이Ni-SiC복합전침적위례,진행료시험험증.결과표명,재상동봉치전류밀도하,방파맥충전류하SiC적침적량시기타삼류맥충전류파형적1.51배:이당평균전류밀도상동시,방파맥충전류하SiC적침적량시기타삼류전류파형적1.06배.분석료전류밀도대얼기체상SiC침적량적영향.
The mathematical relationship between the volume fraction of inert particles in deposit and the current applied with rectangular, ramp-up, ramp-down and triangular waveforms in pulsed composite electrodeposition was derived from Guglielmi's model, and then validated taking Ni-SiC composite electrodeposition as an example.The results showed that the amount of SiC deposited with rectangular pulse is 1.51 times that deposited with other three waveforms at the same peak current density, but is 1.06 times that deposited with other three waveforms at the same average current density. The effect of current density on the amount of SiC embedded in Ni matrix was analyzed.