电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2010年
1期
4-7
,共4页
李娅%冯可芹%吴金岭%柯思璇%文敏%周翔
李婭%馮可芹%吳金嶺%柯思璇%文敏%週翔
리아%풍가근%오금령%가사선%문민%주상
W-Cu合金%快速烧结%压力%电场
W-Cu閤金%快速燒結%壓力%電場
W-Cu합금%쾌속소결%압력%전장
W-Cu alloy%rapid sintering%pressure%electric field
采用Gleeble-3500D热模拟机,用电场快速烧结的方法制得W-Cu合金.通过对烧结压坯的密度、显微结构以及硬度的分析,研究了压力对W-Cu合金烧结的影响.结果表明:W-Cu合金在800 ℃、3 min内快速烧结可获得晶粒较细小、显微组织较均匀的烧结体;在10~30 MPa范围内加压能有效促进烧结体的致密化,可获得相对密度为92.60% ~ 94.84%的W-Cu合金烧结体.但是随着压力的增加,烧结体的相对密度增加不明显.压力可使该烧结体显微硬度增高.
採用Gleeble-3500D熱模擬機,用電場快速燒結的方法製得W-Cu閤金.通過對燒結壓坯的密度、顯微結構以及硬度的分析,研究瞭壓力對W-Cu閤金燒結的影響.結果錶明:W-Cu閤金在800 ℃、3 min內快速燒結可穫得晶粒較細小、顯微組織較均勻的燒結體;在10~30 MPa範圍內加壓能有效促進燒結體的緻密化,可穫得相對密度為92.60% ~ 94.84%的W-Cu閤金燒結體.但是隨著壓力的增加,燒結體的相對密度增加不明顯.壓力可使該燒結體顯微硬度增高.
채용Gleeble-3500D열모의궤,용전장쾌속소결적방법제득W-Cu합금.통과대소결압배적밀도、현미결구이급경도적분석,연구료압력대W-Cu합금소결적영향.결과표명:W-Cu합금재800 ℃、3 min내쾌속소결가획득정립교세소、현미조직교균균적소결체;재10~30 MPa범위내가압능유효촉진소결체적치밀화,가획득상대밀도위92.60% ~ 94.84%적W-Cu합금소결체.단시수착압력적증가,소결체적상대밀도증가불명현.압력가사해소결체현미경도증고.
W-Cu alloys were prepared by the electric-field-assisted rapid sintering method using the Gleeble-3500D thermal simulation equipment under various pressures.The effects of pressure on the sintering of W-Cu alloy were studied through analyzing the density,microstructure and hardness of the obtained W-Cu sinters.The results show that W-Cu alloys with fine grains and homogeneous microstructure are obtained after rapid sintering at 800 ℃ for 3 min; With the application of pressure in the range of 10~30 MPa,the densification of sinters is effectively promoted,resulting in the formation of sinters with relative density of 92.6%~94.84%.The density of sinters is increased significantly after 10 MPa pressure is applied,however,the density increases at a much lower rate with increasing pressure further.Moreover,pressure application increases the microhardness of W-Cu alloys.