CAJ | 학술논문

概要地评述了无铅焊料中低银含量的锡-银-铜（SnAgCu）体系的发展方向。由于高银含量的锡-银-铜（SnAgCu）体系存在着成本高和耐跌落（摔）性差的问题,它将被低银含量的锡-银-铜（SnAgCu）体系所取代。在低银含量的锡-银-铜（SnAgCu）体系中加入某些微量添加剂可以达到锡-铅焊料的性能水平。
개요지평술료무연한료중저은함량적석-은-동（SnAgCu）체계적발전방향。유우고은함량적석-은-동（SnAgCu）체계존재착성본고화내질락（솔）성차적문제,타장피저은함량적석-은-동（SnAgCu）체계소취대。재저은함량적석-은-동（SnAgCu）체계중가입모사미량첨가제가이체도석-연한료적성능수평。
The paper describes that the development direction of low-Ag content Sn-Ag-Cu system in lead-free solder.In the high-Ag content Sn-Ag-Cu system,it has the problem of high-cost and anti-dropping property,the solution is to replace it by low-Ag content Sn-Ag-Cu system.The micro-additive in low-Ag content Sn-Ag-Cu system may arrive on the property-level of Sn-Pb system.