兵器材料科学与工程
兵器材料科學與工程
병기재료과학여공정
Ordnance Material Science and Engineering
2010年
1期
45-49
,共5页
Sn-Ag-Cu无铅焊锡粉末%导液管内径%合金过热度%有效雾化率%粉末特性
Sn-Ag-Cu無鉛銲錫粉末%導液管內徑%閤金過熱度%有效霧化率%粉末特性
Sn-Ag-Cu무연한석분말%도액관내경%합금과열도%유효무화솔%분말특성
Sn-Ag-Cu lead-free solder powder%inner diameter of delivery tube%superheat condition for alloy%efficient atomization efficiency%property of powder
利用自行设计的超音速雾化制粉装置,通过正交实验法对Sn3Ag2.8Cu无铅焊锡粉末的雾化工艺参数进行优化,研究合金过热度和导液管内径对Sn3Ag2.8Cu无铅焊锡粉末有效雾化率、平均粒径、粒度分布及氧含量的影响.结果表明:过热度对无铅焊锡雾化粉末的平均粒径和氧含量影响更大;导液管内径对无铅焊锡雾化粉末有效雾化率和离散度影响更大.当过热度为250 ℃,导液管内径为3 mm,雾化粉末具有更好的综合性能.在与Cu基板的钎焊中,和Sn37Pb粉末相比,利用Sn3Ag2.8Cu粉末配制的焊锡膏与铜基板之间形成的IMC层更厚,且更不规则.
利用自行設計的超音速霧化製粉裝置,通過正交實驗法對Sn3Ag2.8Cu無鉛銲錫粉末的霧化工藝參數進行優化,研究閤金過熱度和導液管內徑對Sn3Ag2.8Cu無鉛銲錫粉末有效霧化率、平均粒徑、粒度分佈及氧含量的影響.結果錶明:過熱度對無鉛銲錫霧化粉末的平均粒徑和氧含量影響更大;導液管內徑對無鉛銲錫霧化粉末有效霧化率和離散度影響更大.噹過熱度為250 ℃,導液管內徑為3 mm,霧化粉末具有更好的綜閤性能.在與Cu基闆的釬銲中,和Sn37Pb粉末相比,利用Sn3Ag2.8Cu粉末配製的銲錫膏與銅基闆之間形成的IMC層更厚,且更不規則.
이용자행설계적초음속무화제분장치,통과정교실험법대Sn3Ag2.8Cu무연한석분말적무화공예삼수진행우화,연구합금과열도화도액관내경대Sn3Ag2.8Cu무연한석분말유효무화솔、평균립경、립도분포급양함량적영향.결과표명:과열도대무연한석무화분말적평균립경화양함량영향경대;도액관내경대무연한석무화분말유효무화솔화리산도영향경대.당과열도위250 ℃,도액관내경위3 mm,무화분말구유경호적종합성능.재여Cu기판적천한중,화Sn37Pb분말상비,이용Sn3Ag2.8Cu분말배제적한석고여동기판지간형성적IMC층경후,차경불규칙.
The experiment studied the effects of inner diameter of the delivery tube and the superheat condition for alloy on the properties such as efficient atomization efficiency, average diameter, size distribution and oxygen content of Sn3Ag2.8Cu lead-free solder powder with the supersonic atomizer designed by ourselves, and optimized atomizing processing parameters of the lead-free solder powder by orthogonal experimental design. The results show that the superheat condition for alloy has more effects on the average diameter and oxygen content of the powders, the inner diameter of the delivery tube has more effects on the efficient atomization efficiency and size distribution of the powders. When the superheating temperature for alloy is 250 ℃, and the inner diameter of delivery tube is 3 mm, the atomized powder possesses optimal combination property. When the Sn3Ag2.8Cu powder is brazed with the copper plate, the IMC layers is thicker and more irregular, compared with Sn37Pb powder.