电镀与涂饰
電鍍與塗飾
전도여도식
ELECTROPLATING & FINISHING
2009年
10期
32-35
,共4页
胡耀红%赵国鹏%谢素玲%袁国伟%张招贤
鬍耀紅%趙國鵬%謝素玲%袁國偉%張招賢
호요홍%조국붕%사소령%원국위%장초현
印刷线路板%蚀刻液%氯化铜
印刷線路闆%蝕刻液%氯化銅
인쇄선로판%식각액%록화동
printed circuit board%etching solution%cupric chloride
本文分两部分刊出.第一部分介绍了印刷线路板的生产工艺,以及各种蚀刻液的特点.概述了影响酸性氯化铜蚀刻液蚀刻速率的因素及其槽液维护,比较了酸性与碱性氯化铜蚀刻液的性能及操作条件.
本文分兩部分刊齣.第一部分介紹瞭印刷線路闆的生產工藝,以及各種蝕刻液的特點.概述瞭影響痠性氯化銅蝕刻液蝕刻速率的因素及其槽液維護,比較瞭痠性與堿性氯化銅蝕刻液的性能及操作條件.
본문분량부분간출.제일부분개소료인쇄선로판적생산공예,이급각충식각액적특점.개술료영향산성록화동식각액식각속솔적인소급기조액유호,비교료산성여감성록화동식각액적성능급조작조건.
This article is to be published in two parts. In the first part, the production process of printed circuit board (PCB) and the features of various etching solutions were introduced. The factors affecting the etching rate of acid cupric chloride etching bath and its maintenance were summarized. The performance and operation conditions of acid and alkaline cupric chloride etching solutions were compared.