低温烧结介质基板材料研究进展
저온소결개질기판재료연구진전
Research progress of LTCC materials for the dielectric substrate
  • 万方数据
    电子元件与材料 전자원건여재료
    ELECTRONIC COMPONENTS & MATERIALS
    2010年 1期 70-74 ,共5页

    朱建华%丁晓鸿%滕林%吕文中%雷文

    주건화%정효홍%등림%려문중%뢰문

    无机非金属材料%低温烧结%综述%介质基板%匹配共烧 無機非金屬材料%低溫燒結%綜述%介質基闆%匹配共燒
    무궤비금속재료%저온소결%종술%개질기판%필배공소
    non-metallic inorganic materials%low temperature sintering%review%dielectric substrate%perfect match co-firing
    从陶瓷基介质材料和微晶玻璃基介质材料两个方面进行综述,介绍了几种低温烧结介质基板材料的国内外研究进展,研究了低温烧结介质基板材料与内电极的异相匹配共烧的重要性,探讨了低温烧结介质基板材料主要存在的问题和发展趋势.
    종도자기개질재료화미정파리기개질재료량개방면진행종술,개소료궤충저온소결개질기판재료적국내외연구진전,연구료저온소결개질기판재료여내전겁적이상필배공소적중요성,탐토료저온소결개질기판재료주요존재적문제화발전추세.
    LTCC materials for the dielectric substrate can be divided into ceramic series and glass-ceramics series,and the development of several LTCC materials for dielectric substrate application at home and abroad is described.Based on those materials,the importance of perfect match co-firing between the LTCC materials and the inner electrode is investigated.Finally,the existing problems and development trends of these LTCC materials are discussed.
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