中国有色金属学报(英文版)
中國有色金屬學報(英文版)
중국유색금속학보(영문판)
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
2011年
6期
1340-1347
,共8页
吴洪军%马文会%陈秀华%蒋咏%梅向阳%张聪%吴兴惠
吳洪軍%馬文會%陳秀華%蔣詠%梅嚮暘%張聰%吳興惠
오홍군%마문회%진수화%장영%매향양%장총%오흥혜
超冶金级硅%退火%位错密度%晶界
超冶金級硅%退火%位錯密度%晶界
초야금급규%퇴화%위착밀도%정계
upgraded metallurgical grade (UMG-Si)%annealing%dislocation density%grain boundaries
对超冶金级硅进行不同条件下的热退火实验研究.利用金相显微镜、电子背散射衍射和X射线衍射仪分别对退火前后多晶硅不同部位的位错、晶界和择优生长取向进行表征.结果表明:退火前后多晶硅中的位错密度大小分布顺序始终是中部<底部<项部.随着退火温度的升高,位错密度逐渐减小;小角度晶界不断减少,直至消失;CSL晶界比例先增加后减小.在1 200℃下退火3h后,多晶硅中的孪晶晶界∑3达到28%;多晶硅上、中、下部的晶粒分别获得最佳择优生长取向,这将对后续硅材料的加工及多晶硅太阳能电池转化效率的提高起到促进作用.
對超冶金級硅進行不同條件下的熱退火實驗研究.利用金相顯微鏡、電子揹散射衍射和X射線衍射儀分彆對退火前後多晶硅不同部位的位錯、晶界和擇優生長取嚮進行錶徵.結果錶明:退火前後多晶硅中的位錯密度大小分佈順序始終是中部<底部<項部.隨著退火溫度的升高,位錯密度逐漸減小;小角度晶界不斷減少,直至消失;CSL晶界比例先增加後減小.在1 200℃下退火3h後,多晶硅中的孿晶晶界∑3達到28%;多晶硅上、中、下部的晶粒分彆穫得最佳擇優生長取嚮,這將對後續硅材料的加工及多晶硅太暘能電池轉化效率的提高起到促進作用.
대초야금급규진행불동조건하적열퇴화실험연구.이용금상현미경、전자배산사연사화X사선연사의분별대퇴화전후다정규불동부위적위착、정계화택우생장취향진행표정.결과표명:퇴화전후다정규중적위착밀도대소분포순서시종시중부<저부<항부.수착퇴화온도적승고,위착밀도축점감소;소각도정계불단감소,직지소실;CSL정계비례선증가후감소.재1 200℃하퇴화3h후,다정규중적련정정계∑3체도28%;다정규상、중、하부적정립분별획득최가택우생장취향,저장대후속규재료적가공급다정규태양능전지전화효솔적제고기도촉진작용.
Effect of thermal annealing on the upgraded metallurgical grade(UMG)-Si was investigated under different conditions.The dislocation,grain boundaries and preferred growth orientation of Si ingot were characterized by optical microscopy,electron back scattering diffraction (EBSD) and X-ray diffractometry (XRD),respectively.The arrange order of dislocation density of Si ingot is from the lowest in the middle to the lower in the bottom and low in the top before and after annealing.And it decreases gradually with increase of the annealing temperature.The number of small angle grain boundaries declines gradually until disappears whereas the proportion of coincidence site lattice (CSL) grain boundaries increases firstly and then decreases.The twin boundary Σ3 reaches the highest proportion of 28% after annealing at 1 200 ℃ for 3 h.Furthermore,the crystal grains in different positions gain the best preferred growth orientation,which can promote the following machining of Si ingot and the conversion efficiency of solar cells.