CAJ | 학술논문

介绍了一种用机械研磨法制备集成电路TEM楔形样品的技术,讨论了该制样技术所需注意的关键点,并给出了判断样品薄区是否满足TEM分析要求的两种方法.楔形样品减薄技术兼具制样速度快和样品质量好的优点.该技术既可用于制备非定点TEM样品,也可用于制备定点的TEM样品.给出了用该技术制备的定点失效的MOS器件TEM照片.熟练的技术人员可以用此方法在半小时内完成一个样品的制备.
개소료일충용궤계연마법제비집성전로TEM설형양품적기술,토론료해제양기술소수주의적관건점,병급출료판단양품박구시부만족TEM분석요구적량충방법.설형양품감박기술겸구제양속도쾌화양품질량호적우점.해기술기가용우제비비정점TEM양품,야가용우제비정점적TEM양품.급출료용해기술제비적정점실효적MOS기건TEM조편.숙련적기술인원가이용차방법재반소시내완성일개양품적제비.
Wedge specimen preparation technique for TEM analysis was introduced. Key points about this technique such as polish angle and so on were discussed. Two methods were given to judge if the thin area was acceptable for TEM analysis. Wedge polish may locate the interested area as the thinnest area, and it also has the advantages of high efficiency and high quality during TEM specimen preparation. Wedge polish technique can be applied to the preparation of both non-specific site TEM sample and the specific site TEM sample. TEM image are given to show the success of this technique on a specific site failed MOS device. A skilled technician can finish the TEM specimen preparation within half an hour using this technique.