CAJ | 학술논문

为避免双键合点破坏性拉力实验不易准确的缺陷和剪切力测试不能评价键合点整体特性的缺陷,采用了破坏性单键合点的测试方法.在尽量排除其他干扰因素的情况下,通过实验比较了10种不同平整度条件下细Al丝超声引线键合的结果.结果表明,平整度对超声引线键合的强度有影响,随着平整度的提高,键合强度和稳定度也随之提高.实际测试键合拉力时发现,键合良好断裂点均在跟键(heel)处,采取补强的方式使1.25 mil(3.125×10~(-3) cm)细Al丝超声键合后的键合强度均值可以达到0.156 8 N.分析了以上实验现象产生的原因,探讨了键合强度形成的机理.
위피면쌍건합점파배성랍력실험불역준학적결함화전절력측시불능평개건합점정체특성적결함,채용료파배성단건합점적측시방법.재진량배제기타간우인소적정황하,통과실험비교료10충불동평정도조건하세Al사초성인선건합적결과.결과표명,평정도대초성인선건합적강도유영향,수착평정도적제고,건합강도화은정도야수지제고.실제측시건합랍력시발현,건합량호단렬점균재근건(heel)처,채취보강적방식사1.25 mil(3.125×10~(-3) cm)세Al사초성건합후적건합강도균치가이체도0.156 8 N.분석료이상실험현상산생적원인,탐토료건합강도형성적궤리.
Destructive single bond test was adopted for the imprecision of the destructive double bond test and the shear strength test can not estimate the whole characteristic of the bond. 10 groups of experimental results were compared with different substrate surface smoothness while other factors were omitted. The experimental results show that the higher the surface smoothness of the substrate, the bigger the bond strength and the higher the bond stability. Besides that the thickness and area of atomic diffusion is not large enough in the interface between Al wire and substrate. It is found that all the breakpoints occur at the heel when the bonding wire is pulled. The average bond strength of 1.25 mil (3.125 × 10~(-3) cm) thin Al wire is up to 0.156 8 N through strengthening. The reason of the experimental phenomenon and the mechanism of the bond strength were analyzed.