电镀与涂饰
電鍍與塗飾
전도여도식
ELECTROPLATING & FINISHING
2010年
2期
1-3
,共3页
铜包铝线%无氰预镀铜%焦磷酸盐%工艺%结合强度
銅包鋁線%無氰預鍍銅%焦燐痠鹽%工藝%結閤彊度
동포려선%무청예도동%초린산염%공예%결합강도
copper-clad aluminum wire%non-cyanidepre-copper plating%pyrophosphate%process%bonding strength
研究了一种铜包铝线浸锌后的无氰预镀铜工艺.最佳镀液配方为:20～25 g/L焦磷酸铜,320～350 g/L焦磷酸钾,40～45 g/L辅助配位剂A(氨羧化合物),15～20 g/t辅助配位剂B(有机酸).讨论了起始电流密度、温度、预镀时间及pH对镀层结合强度的影响,得出最佳工艺参数为:起始电流密度0.3～1.1 A/dm~2,温度25～40℃,预镀时间3 min,pH 8.0～8.8.
研究瞭一種銅包鋁線浸鋅後的無氰預鍍銅工藝.最佳鍍液配方為:20～25 g/L焦燐痠銅,320～350 g/L焦燐痠鉀,40～45 g/L輔助配位劑A(氨羧化閤物),15～20 g/t輔助配位劑B(有機痠).討論瞭起始電流密度、溫度、預鍍時間及pH對鍍層結閤彊度的影響,得齣最佳工藝參數為:起始電流密度0.3～1.1 A/dm~2,溫度25～40℃,預鍍時間3 min,pH 8.0～8.8.
연구료일충동포려선침자후적무청예도동공예.최가도액배방위:20～25 g/L초린산동,320～350 g/L초린산갑,40～45 g/L보조배위제A(안최화합물),15～20 g/t보조배위제B(유궤산).토론료기시전류밀도、온도、예도시간급pH대도층결합강도적영향,득출최가공예삼수위:기시전류밀도0.3～1.1 A/dm~2,온도25～40℃,예도시간3 min,pH 8.0～8.8.
A non-cyanide pre-copper plating process on copper-clad aluminum wire after zinc dipping was studied. The optimal bath composition is as follows: copper pyro-phosphate 20-25 g/L, potassium pyrophosphate 320-350 g/L, as well as auxiliary complexing agents A (an amino carboxylic compound) 40-45 g/L and B (an organic acid) 15-20 g/L. The effects of technological parameters on the bonding strength of coatings were discussed. The optimal parameters are as follows: temperature 25-40℃, pH 8.0-8.8, initial current density 0.3-1.1 A/dm~2, and time 3 min.
