电镀与涂饰
電鍍與塗飾
전도여도식
ELECTROPLATING & FINISHING
2001年
2期
22-23,52
,共3页
铜%铜合金%化学抛光
銅%銅閤金%化學拋光
동%동합금%화학포광
研制出一种铜及其合金化学抛光新工艺。在传统的硫酸抛光液中加入一种淡绿色的粉末晶体。介绍了该抛光液的配制,研究了温度、基体材料对抛光效果的影响。结果表明,该工艺抛光速度快、腐蚀性低、无黄烟、环境污染小、成本低。
研製齣一種銅及其閤金化學拋光新工藝。在傳統的硫痠拋光液中加入一種淡綠色的粉末晶體。介紹瞭該拋光液的配製,研究瞭溫度、基體材料對拋光效果的影響。結果錶明,該工藝拋光速度快、腐蝕性低、無黃煙、環境汙染小、成本低。
연제출일충동급기합금화학포광신공예。재전통적류산포광액중가입일충담록색적분말정체。개소료해포광액적배제,연구료온도、기체재료대포광효과적영향。결과표명,해공예포광속도쾌、부식성저、무황연、배경오염소、성본저。
A new chemical polishing process for copper and its alloys wasadvanced which is composed of traditional sulfuric acid solution and a light green powder crystal. Preparation of the polishing solution was described. The effects of temperature, base materials on polishing results was studied. The results show that the process has strength such as fast rate of polishing, low corrosivity, no yellow fume produced, light environmental pollution and low cost.