CAJ | 학술논문

大功率LED器件的基座与散热基板之间的接触热阻会阻碍其芯片PN结与散热基板之间的热传导，从而影响到器件的光、色、电性能及寿命。导热胶片用于填充材料界面之间接合或接触时产生的微空隙及表面凹凸不平的孔洞，是减小接触热阻、降低芯片PN结温度的有效手段。文章主要通过测定热阻值来开展对导热胶片在实际应用中导热性能的研究。通过阻容模型、加热曲线及传热结构，深入解析导热胶片在整个LED热管理系统中的工作情况，以及其对器件各部分散热性能的影响，取得有意义的实验结果并且提出一种测试导热胶片性能的新方法。
대공솔LED기건적기좌여산열기판지간적접촉열조회조애기심편PN결여산열기판지간적열전도，종이영향도기건적광、색、전성능급수명。도열효편용우전충재료계면지간접합혹접촉시산생적미공극급표면요철불평적공동，시감소접촉열조、강저심편PN결온도적유효수단。문장주요통과측정열조치래개전대도열효편재실제응용중도열성능적연구。통과조용모형、가열곡선급전열결구，심입해석도열효편재정개LED열관리계통중적공작정황，이급기대기건각부분산열성능적영향，취득유의의적실험결과병차제출일충측시도열효편성능적신방법。
Contact resistance exists in the contact face between LED （light emitting diode） substrate and heat sink, which will hinder thermal conducting from PN junction to heat sink and affect its light, color, ele ctrical performance and lifetime. Thermal interface materials can be used to fill the holes and gaps between the contact face. This method can reduce contact thermal resistance and the temperature of PN junction. The thermal properties of thermal interface materials were studied by measuring its thermal resistance. In addition, its role in the LED cooling system can be analyzed by RC model, heating curve, structure function. This paper proposed a new testing method of thermal interface materials.