CAJ | 학술논문

研究了BGA直径分别为750μm、1 000μm、1 300μm的Sn-9Zn/Cu焊点剪切强度及其变化规律。采用SEM和EDX对剪切断口进行观察和元素成分分析。试验结果表明,随着焊球直径的增大,焊点剪切强度先减小后增大。剪切断裂位置大部分位于钎料内部,局部位于界面化合物Cu5Zn8处。在相同的剪切高度与剪切速率下,随着焊点直径的增加,断裂形式依次为韧性断裂、脆性断裂、韧脆混合断裂和抛物线型韧窝变浅。
연구료BGA직경분별위750μm、1 000μm、1 300μm적Sn-9Zn/Cu한점전절강도급기변화규률。채용SEM화EDX대전절단구진행관찰화원소성분분석。시험결과표명,수착한구직경적증대,한점전절강도선감소후증대。전절단렬위치대부분위우천료내부,국부위우계면화합물Cu5Zn8처。재상동적전절고도여전절속솔하,수착한점직경적증가,단렬형식의차위인성단렬、취성단렬、인취혼합단렬화포물선형인와변천。
The shear strength and changing regularity of Sn-9Zn BGA solder joints are studied,BGA diameters are 750 μm,1 000μm,1300μm.SEM and EDX are used to observe the shear fractures and element component.The results show that,Sn-9Zn/Cu solder joints shear strength first decreases and then increased with the increase of solder ball diameter.The fracture positions of Solder joints are most located in solders,and partially in the interface compounds Cu5Zn8 after welding.In the same shear height and shear rate,with the increase of the diameter of solder joint,the fracture mode is in order as ductile fracture,brittle fracture and ductile-brittle mixed fracture;The parabolic dimples become shallow.