CAJ | 학술논문

利用XRD、SEM及EDAX研究了钎焊和时效过程中低银Sn-2.5Ag-0.7Cu(0.1RE)/Cu焊点界面区显微组织和Cu_6Sn_5金属间化合物的生长行为.结果表明,钎焊过程中焊点界面区Cu_6Sn_5金属间化合物的厚度是溶解和生长两方面共同作用的结果;随时效时间的增加,焊点界面区Cu_6Sn_5的形貌由扇贝状转变为层状,其长大动力学符合抛物线规律,由扩散机制控制;添加0.1%(质量分数,下同)的RE能有效减慢界面Cu_6Sn_5金属间化合物在钎焊及时效过程中的长大速度,改变焊点的断裂机制,提高其可靠性.
이용XRD、SEM급EDAX연구료천한화시효과정중저은Sn-2.5Ag-0.7Cu(0.1RE)/Cu한점계면구현미조직화Cu_6Sn_5금속간화합물적생장행위.결과표명,천한과정중한점계면구Cu_6Sn_5금속간화합물적후도시용해화생장량방면공동작용적결과;수시효시간적증가,한점계면구Cu_6Sn_5적형모유선패상전변위층상,기장대동역학부합포물선규률,유확산궤제공제;첨가0.1%(질량분수,하동)적RE능유효감만계면Cu_6Sn_5금속간화합물재천한급시효과정중적장대속도,개변한점적단렬궤제,제고기가고성.
The microstructure of low-Ag-content Sn-2.5Ag-0.7Cu(0.1RE)/Cu solder joint interface and growth behavior of Cu_6Sn_5 intermetallic compound (IMC) were investigated by XRD, SEM and EDAX. The results show that the Cu_6Sn_5 thickness of the solder joint interface is decided by its dissolution and growing during soldering. With the aging time increasing, the Cu_6Sn_5 morphology of the solder joint interface changed from scallop-like to lamellar; the growth dynamics follows the parabola law and its growth behavior is controlled by diffusion mechanism. Addition of 0.1% RE (mass fraction) in the Sn-2.5Ag-0.7Cu solder alloy can effectively reduce the growing rate of the solder joint Cu_6Sn_5 IMC during the soldering and aging period, and change the fracture mechanism of solder joint; therefore the reliability of the solder joint can be greatly improved.