电工材料
電工材料
전공재료
ELECTRICAL ENGINEERING MATERIALS
2008年
4期
3-8
,共6页
苗柏和%郭晖%张艳%刘国勋%王文斌
苗柏和%郭暉%張豔%劉國勛%王文斌
묘백화%곽휘%장염%류국훈%왕문빈
CuCr触头材料%相界面%电子衍射花样%晶体学取向
CuCr觸頭材料%相界麵%電子衍射花樣%晶體學取嚮
CuCr촉두재료%상계면%전자연사화양%정체학취향
CuCr contact materials%phases interface%electron diffraction patterns%crystallographic orientation
用透射电子显微镜(TEM)的选区电予衍射、衍衬及x射线能谱分析了真空熔铸Cu一25Cr合金触头材料和烧结CuCr25粉末合金触头材料中Cu/Cr两相界面及其显微组织.一些细小的Cr二次枝晶与Cu基体有择优取向关系,即(110)c,//(111)c.和[011].,∥[112]c.,间距约6 nm的单列错配位错分布在Cr/Cu两相的半共格界面上,这表明Cu一25Cr合金材料中Cr/Cu两相的界面具有更好的协调性.与Cu.25Cr合金材料相反,CuCr25粉末合金烧结材料中Cu/Cr粒子之间形成的是非共格界面,且有少量的Al扣,和Cr20,等夹杂物聚集在松散的Cu/Cr颗粒间的界面上.据此,本文讨论了CuCr触头材料中Cu/Cr两相间的界面结构对材料机械性能、断裂特性及电接触性能的影响.
用透射電子顯微鏡(TEM)的選區電予衍射、衍襯及x射線能譜分析瞭真空鎔鑄Cu一25Cr閤金觸頭材料和燒結CuCr25粉末閤金觸頭材料中Cu/Cr兩相界麵及其顯微組織.一些細小的Cr二次枝晶與Cu基體有擇優取嚮關繫,即(110)c,//(111)c.和[011].,∥[112]c.,間距約6 nm的單列錯配位錯分佈在Cr/Cu兩相的半共格界麵上,這錶明Cu一25Cr閤金材料中Cr/Cu兩相的界麵具有更好的協調性.與Cu.25Cr閤金材料相反,CuCr25粉末閤金燒結材料中Cu/Cr粒子之間形成的是非共格界麵,且有少量的Al釦,和Cr20,等夾雜物聚集在鬆散的Cu/Cr顆粒間的界麵上.據此,本文討論瞭CuCr觸頭材料中Cu/Cr兩相間的界麵結構對材料機械性能、斷裂特性及電接觸性能的影響.
용투사전자현미경(TEM)적선구전여연사、연츤급x사선능보분석료진공용주Cu일25Cr합금촉두재료화소결CuCr25분말합금촉두재료중Cu/Cr량상계면급기현미조직.일사세소적Cr이차지정여Cu기체유택우취향관계,즉(110)c,//(111)c.화[011].,∥[112]c.,간거약6 nm적단렬착배위착분포재Cr/Cu량상적반공격계면상,저표명Cu일25Cr합금재료중Cr/Cu량상적계면구유경호적협조성.여Cu.25Cr합금재료상반,CuCr25분말합금소결재료중Cu/Cr입자지간형성적시비공격계면,차유소량적Al구,화Cr20,등협잡물취집재송산적Cu/Cr과립간적계면상.거차,본문토론료CuCr촉두재료중Cu/Cr량상간적계면결구대재료궤계성능、단렬특성급전접촉성능적영향.
The microstructure and interface of Cu/Cr phases in vacuum casting Cu-25Cr alloy and sintered CuCr25 p/m contact materials were investigated by transmission electron microscopy (TEM). Some fine secondary Cr-dendrites have preferred orientation relationships of (110)Cr//(111)Cu and [011]Cr//[112]Cu, and a single set of misfit dislocations separatedby a space of ~6 nm are distributed on the semicoherent interfaces of Cr/Cu phases, which shown that the interface structure of two phases in the Cu-25Cr alloy material is better coordination. In contrast to the Cu-25Cr alloy material, incoherent interfacebetween Cr/Cu particles in CuCr25 p/m material were formed by frictional force,and a few inclusions of Al2O3 and Cr2O3 were aggregated on the lose bonding interface of Cu/Crparticles in the materials. Thereby the effects of interface structure of Cr/Cu phases in the CuCr contact materials on the mechanical properties, fracture characteristics and contact performance of contact materials are discussed.