CAJ | 학술논문

为实现微/纳结构三维形貌的高精度测量,提出利用显微干涉技术和偏振技术相结合的方法来研制微/纳结构三维形貌亚纳米级精度测试系统.首先,利用五步相移干涉技术采集5幅带有n/2相移增量的干涉条纹图.然后,通过Hadharan五步相移算法得到包裹相位图.最后,利用分割线相位去包裹算法和相位高度关系转换得到微/纳结构三维形貌.在测试过程中通过偏振片产生强度可调的线偏振光,再由1/2波片改变偏振光在分光镜中的分光比,补偿参考镜与试件的反射性能差异,可得到亮度适中且对比度高的干涉条纹图,从而有利于实现微/纳结构三维形貌的高精度测量.系统的轮廓算术平均偏差R_a的重复测量精度可迭0.06 nm,最大示值误差不到±1%,示值变动性不到0.5%.通过对标准多刻线样板、硅微麦克风膜和硅微陀螺仪折叠梁的三维形貌测量验证了系统的有效性和实用性.
위실현미/납결구삼유형모적고정도측량,제출이용현미간섭기술화편진기술상결합적방법래연제미/납결구삼유형모아납미급정도측시계통.수선,이용오보상이간섭기술채집5폭대유n/2상이증량적간섭조문도.연후,통과Hadharan오보상이산법득도포과상위도.최후,이용분할선상위거포과산법화상위고도관계전환득도미/납결구삼유형모.재측시과정중통과편진편산생강도가조적선편진광,재유1/2파편개변편진광재분광경중적분광비,보상삼고경여시건적반사성능차이,가득도량도괄중차대비도고적간섭조문도,종이유리우실현미/납결구삼유형모적고정도측량.계통적륜곽산술평균편차R_a적중복측량정도가질0.06 nm,최대시치오차불도±1%,시치변동성불도0.5%.통과대표준다각선양판、규미맥극풍막화규미타라의절첩량적삼유형모측량험증료계통적유효성화실용성.
In order to test 3D profile of micro/nano structures with high resolution, a measurement system was developed based on microscopic interferometry and polarization technique. First, five interferograms with π/2-phase increase were acquired by five-step phase-shift interferometry. Then wrapped phase maps were calculated with Hariharan five-step-phase-shift algorithm. Finally, 3D profile of micro/nano structure could be gotten with branch-cut unwrapping algorithm and the phase-height formula. A polarizer provided a polarization beam and adjusted its illumination power. The polarized beam was parceled into two perpendicular directions by a polarization-beam splitter, and the intensities proportion of the two beams could be adjusted by rotating a 1/2-waveplate making it possible to compensate the differences of the reflectances between the sample and the reference mirror. This arrangement allowed that the interferograms had the advantages of high contrast and optimum intensity, and this was useful to increase system resolution. The system's main performance parameters include the Ro-repeatability-measurement resolution better than 0.06 nm, the error indication better than ±1%, and the variation of indication better than 0.5%. The experimental work conducted on several typical micro/nano structures such as standard multi-indents structures, Si-microphone membranes and Si-micro-gyroscope folded-beams confirms that such a measurement system is efficient to characterize 3D profile of micro/nano structures with high resolution.