环氧树脂在半导体器件中的应用及发展
배양수지재반도체기건중적응용급발전
The Application and Development of Epoxy in Semiconductive Elements
  • 万方数据
    化工进展 화공진전
    CHEMICAL INDUSTRY AND ENGINEERING PROGRESS
    2001年 5期 28-31 ,共4页

    母继荣

    모계영

    环氧树脂%塑封料%集成电路%封装 環氧樹脂%塑封料%集成電路%封裝
    배양수지%소봉료%집성전로%봉장
    本文对环氧树脂在半导体，尤其是集成电路封装中的应用进行了介绍，同时对目前国外各种改性环氧树脂以及塑封料中所用二氧化硅的合成等方面的发展进行了简述。
    본문대배양수지재반도체，우기시집성전로봉장중적응용진행료개소，동시대목전국외각충개성배양수지이급소봉료중소용이양화규적합성등방면적발전진행료간술。
    The application of epoxy resin for semiconductor, especially for the sealing of integrated circuit IC was introduced in this paper. The abroad development of improving epoxy resin and the synthesis of SiO2 used in plastic sealing material was reviewed also.
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