CAJ | 학술논문

倒装焊技术被越来越多地应用于微波组件和光电子器件等高频和高速电子产品的生产制造中。介绍了倒装焊机的功能要求。重点分析了复合精密定位平台和双面双视场光学系统的设计原理和系统设计方案。通过建立设计模型,提出一种实用的图像对位算法,经应用验证,该算法能满足系统的对位精度要求。
도장한기술피월래월다지응용우미파조건화광전자기건등고빈화고속전자산품적생산제조중。개소료도장한궤적공능요구。중점분석료복합정밀정위평태화쌍면쌍시장광학계통적설계원리화계통설계방안。통과건립설계모형,제출일충실용적도상대위산법,경응용험증,해산법능만족계통적대위정도요구。
Flip Chip technology has been used widely in the manufacture of high frequency and high speed electric products,such as micro-wave module and photoelectric parts.Introduce the requirement of the function of Flip Chip Bonder.Analyze mainly the design principle and design project of the complex precision positioning platform and the dual planes dual FOV optical system.Put forward a practical image alignment algorithm based on setting up the design model.The algorithm can meet the precision requirement of aligning.