CAJ | 학술논문

　　文章通过对单器件的分立IGBT的封装结构进行分析，针对其结构特点和封装技术要求，特别是封装关键工艺芯片切割的影响，对装片、焊接方面进行工艺研究。并通过试验分析解决实际生产所出现的技术问题，由此形成一套适应于大批量封装生产的IGBT封装工艺技术，成功地应用于分立IGBT器件的批量生产，保证了产品的可靠性，取得了很好的生产效益。
　　문장통과대단기건적분립IGBT적봉장결구진행분석，침대기결구특점화봉장기술요구，특별시봉장관건공예심편절할적영향，대장편、한접방면진행공예연구。병통과시험분석해결실제생산소출현적기술문제，유차형성일투괄응우대비량봉장생산적IGBT봉장공예기술，성공지응용우분립IGBT기건적비량생산，보증료산품적가고성，취득료흔호적생산효익。
This document analyzes the discrete IGBT package structure,technical study in key assembly processes such as chip cutting, die attach, wire bonding, according as its structural characteristics and assembly technology requirements. And by experiment analysis to solve the technical problems in actual production, thus forming the discrete IGBT assembly technology adapted to the mass production. This technology is successfully used in mass production of discrete IGBT devices to ensure the reliability of the products, and obtain the good production efficiency.