电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2013年
4期
1-5
,共5页
静电防护%静电损伤%集成电路封装
靜電防護%靜電損傷%集成電路封裝
정전방호%정전손상%집성전로봉장
electrostatic protection%electrostatic damage%integrated circuit packaging
文中分析了静电产生的原因、电路静电损伤机理及失效机制。制定了集成电路封装线系统性静电防护措施。其涉及到封装厂房环境静电防护、封装生产设备静电防护、工艺操作静电防护、电路包装和运输过程中的静电防护以及静电防护检测等多个环节。对这些环节的全面控制有利于消除静电对集成电路的损伤。
文中分析瞭靜電產生的原因、電路靜電損傷機理及失效機製。製定瞭集成電路封裝線繫統性靜電防護措施。其涉及到封裝廠房環境靜電防護、封裝生產設備靜電防護、工藝操作靜電防護、電路包裝和運輸過程中的靜電防護以及靜電防護檢測等多箇環節。對這些環節的全麵控製有利于消除靜電對集成電路的損傷。
문중분석료정전산생적원인、전로정전손상궤리급실효궤제。제정료집성전로봉장선계통성정전방호조시。기섭급도봉장엄방배경정전방호、봉장생산설비정전방호、공예조작정전방호、전로포장화운수과정중적정전방호이급정전방호검측등다개배절。대저사배절적전면공제유리우소제정전대집성전로적손상。
The mechanism how static appears,damages and causes failure to ICs are analysed. Comprehensive and systematic static-proof plans are set down for IC packaging line. These plans are about electrostatic protection to plant's environment,electrostatic protection to equipments, electrostatic protection to operation,electrostatic protection to packing & transportation and the check of static. Control of all of these is able to eliminate damage to ICs by static.
