CAJ | 학술논문

随着线路板压合结构的复杂化,差异较大的内层芯板常被设计在一起。但由于芯板特性,工艺流程,菲林涨缩的差异,会导致在压合过程中,芯板由于伸缩比例不一致,而出现层间对准度偏移,以致内短报废的风险。本文通过对此类叠构层偏失效模式分析、验证,最终确认真因是由于层间涨缩差异导致。而针对涨缩性层偏,本文详细介绍了分层补偿方法,原则,相关治工具孔平移,两组同心圆层偏监控方式等,并将这一套改善对策导入实验板进行验证,最终得出本文介绍的涨缩性层偏改善方法及监控方式对改善层间涨缩性层偏有效,且效果明显。
수착선로판압합결구적복잡화,차이교대적내층심판상피설계재일기。단유우심판특성,공예류정,비림창축적차이,회도치재압합과정중,심판유우신축비례불일치,이출현층간대준도편이,이치내단보폐적풍험。본문통과대차류첩구층편실효모식분석、험증,최종학인진인시유우층간창축차이도치。이침대창축성층편,본문상세개소료분층보상방법,원칙,상관치공구공평이,량조동심원층편감공방식등,병장저일투개선대책도입실험판진행험증,최종득출본문개소적창축성층편개선방법급감공방식대개선층간창축성층편유효,차효과명현。
With the circuit board pressing structure becoming complex,difference of inner core plate is often designed to work together.But because the core board characteristics,process flow,film expansion difference,which will result the emergence of interlayer alignment offset and short risk in the pressing process,due to the core plate expansion ratio of inconsistency.Through to the stacking layer partial failure mode analysis,this article validated and finally confirmed the conclusion that interlayer expansion differences is the reason.And according to the expanding layer difference,this paper introduces the hierarchical compensation method,principle,related tools hole translation,two groups of concentric layers of partial monitoring means,and the set of measures to improve introduction experiment board for validation and finally obtains the expansion layer partial improvement method and monitoring means to improve interlayer collapsible layer partial effectively,which shows the obvious effect.