CAJ | 학술논문

电镀工艺能够增加面铜厚度并实现不同层次的导电连接而被广泛的应用于PCB行业。然而，针对该工艺的品质保证绝非易事。电镀工艺受钻孔效果、沉铜前处理、电镀参数等因素的影响，在品质上容易出现铜丝铜粒等不良问题。本文从电镀基本原理出发，初步分析了电镀工艺铜丝的产生原因，并通过试验验证了铜丝产生的原因，得出了有效的改善措施。
전도공예능구증가면동후도병실현불동층차적도전련접이피엄범적응용우PCB행업。연이，침대해공예적품질보증절비역사。전도공예수찬공효과、침동전처리、전도삼수등인소적영향，재품질상용역출현동사동립등불량문제。본문종전도기본원리출발，초보분석료전도공예동사적산생원인，병통과시험험증료동사산생적원인，득출료유효적개선조시。
The electroplating technique is widely used in PCB industry for its function of increasing the surface copper thickness and realizing electrical conduction between different layers. However, quality assurance is a difficult part in the application of the technique. For the influence of the drilling quality, pre-PTH treatments, electroplating parameters etc, defects like the copper wire and copper grains are easily to occur in the manufacturing. The paper analyses the causes of the copper wire in terms of the electroplating technique and test the causes further. And finally the improving measurements adopted proved to be effective.