材料导报
材料導報
재료도보
MATERIALS REVIEW
2009年
21期
115-117
,共3页
氮化铜薄膜%光学带隙%热稳定性%磁控溅射
氮化銅薄膜%光學帶隙%熱穩定性%磁控濺射
담화동박막%광학대극%열은정성%자공천사
copper nitride films%optical band gap%thermal stability%magnetron sputtering
氮化铜(Cu_3N)薄膜是一种新型的电、光学材料,它具有典型的反三氧化铼结构,由于Cu原子没有很好地占据(111)晶格面的紧密位置.在薄膜中掺杂之后,薄膜的电、光学性质会发生显著变化.Cu_3N在较低温度下会分解为Cu和N_2.介绍了Cu_3N的制备方法,总结了该膜制备方法和工艺参数对薄膜结构的影响,分析了在不同N_2分压下薄膜由(111)晶面转向(100)晶面择优生长和薄膜定向生长的原因,讨论了薄膜的电学、光学、热学等物理性质及其在相关方面的应用,并对该膜的物理性质与结构之间的关系作了简要分析.
氮化銅(Cu_3N)薄膜是一種新型的電、光學材料,它具有典型的反三氧化錸結構,由于Cu原子沒有很好地佔據(111)晶格麵的緊密位置.在薄膜中摻雜之後,薄膜的電、光學性質會髮生顯著變化.Cu_3N在較低溫度下會分解為Cu和N_2.介紹瞭Cu_3N的製備方法,總結瞭該膜製備方法和工藝參數對薄膜結構的影響,分析瞭在不同N_2分壓下薄膜由(111)晶麵轉嚮(100)晶麵擇優生長和薄膜定嚮生長的原因,討論瞭薄膜的電學、光學、熱學等物理性質及其在相關方麵的應用,併對該膜的物理性質與結構之間的關繫作瞭簡要分析.
담화동(Cu_3N)박막시일충신형적전、광학재료,타구유전형적반삼양화래결구,유우Cu원자몰유흔호지점거(111)정격면적긴밀위치.재박막중참잡지후,박막적전、광학성질회발생현저변화.Cu_3N재교저온도하회분해위Cu화N_2.개소료Cu_3N적제비방법,총결료해막제비방법화공예삼수대박막결구적영향,분석료재불동N_2분압하박막유(111)정면전향(100)정면택우생장화박막정향생장적원인,토론료박막적전학、광학、열학등물이성질급기재상관방면적응용,병대해막적물이성질여결구지간적관계작료간요분석.
New material of copper nitride (Cu_3N) films will be used in the electrical and optical field, because of its anti-ReO_3 type crystal structure and low decomposing temperature. Since the Cu atoms do not occupy the close-packing sites of (111) plane, the films can be filled by other atoms into the body center, which leads to remarkable change of the electrical and optical properties. The films can decompose into Cu and N_2 at low temperature. In this pa-per, the preparation methods of the films are introduced and the deposition conditions are summarized; the influence of preparation methods and deposition conditions to the compositions and the structure of chemical bonds are explained. The reasons of films' growth prefers the (111) direction at the low nitrogen pressure and the (100) direction at high nitrogen pressure are analyzed. The electrical, optical, calorific properties and applications of the films are also stu-died, and the association between the physical properties and structure is discussed.