酸性镀铜添加剂研究进展
산성도동첨가제연구진전
Research progress on acidic copper plating additives
  • 万方数据
    电镀与涂饰 전도여도식
    ELECTROPLATING & FINISHING
    2010年 1期 26-29 ,共4页

    高泉涌%赵国鹏%胡耀红

    고천용%조국붕%호요홍

    酸性镀铜%添加剂%作用机理%分类%应用 痠性鍍銅%添加劑%作用機理%分類%應用
    산성도동%첨가제%작용궤리%분류%응용
    acidic copper plating%additive%mechanism%classification%application
    综述了酸性镀铜添加剂的分类、作用机理及其应用,概括了酸性镀铜添加剂的研究现状,并进行了展望.
    종술료산성도동첨가제적분류、작용궤리급기응용,개괄료산성도동첨가제적연구현상,병진행료전망.
    The classification, mechanism and application of acidic copper plating additives were reviewed. The research status of acidic copper plating additives was summarized and the prospect was forecasted.
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