半导体学报
半導體學報
반도체학보
CHINESE JOURNAL OF SEMICONDUCTORS
2008年
6期
1136-1140
,共5页
王晓冬%吉元%钟涛兴%李志国%夏洋%刘丹敏%肖卫强
王曉鼕%吉元%鐘濤興%李誌國%夏洋%劉丹敏%肖衛彊
왕효동%길원%종도흥%리지국%하양%류단민%초위강
Cu互连线%织构%错配角%重合点阵晶界%电子背散射衍射
Cu互連線%織構%錯配角%重閤點陣晶界%電子揹散射衍射
Cu호련선%직구%착배각%중합점진정계%전자배산사연사
Cu interconnects%texture%misorientation%coincident site lattice boundaries%EBSD
采用EBSD研究了不同线宽和退火前后Cu互连线的织构和晶界特征分布.Cu互连线均具有多重织构,其中(111)织构强度最高.沉积态样品在室温下发生了自退火现象,并出现了一些异常长大的晶粒.随高宽比降低和退火处理,Cu互连线晶粒尺寸变大,(111)织构得到加强,而具有较低应变程度的织构与(111)织构强度的比例下降.沉积态样品出现了(111)<112>和(111)<231>织构组分.退火后,出现了(111)<110>组分,而且(111)<112>和(111)<231>组分得到增强.Cu互连线以大角度晶界为主,其中具有55°~60°错配角的晶界和∑3晶界比例最高,35°~40°的错配角和∑9晶界次之.随高宽比增加和退火处理,∑3晶界比例逐渐升高,∑9晶界比例下降.
採用EBSD研究瞭不同線寬和退火前後Cu互連線的織構和晶界特徵分佈.Cu互連線均具有多重織構,其中(111)織構彊度最高.沉積態樣品在室溫下髮生瞭自退火現象,併齣現瞭一些異常長大的晶粒.隨高寬比降低和退火處理,Cu互連線晶粒呎吋變大,(111)織構得到加彊,而具有較低應變程度的織構與(111)織構彊度的比例下降.沉積態樣品齣現瞭(111)<112>和(111)<231>織構組分.退火後,齣現瞭(111)<110>組分,而且(111)<112>和(111)<231>組分得到增彊.Cu互連線以大角度晶界為主,其中具有55°~60°錯配角的晶界和∑3晶界比例最高,35°~40°的錯配角和∑9晶界次之.隨高寬比增加和退火處理,∑3晶界比例逐漸升高,∑9晶界比例下降.
채용EBSD연구료불동선관화퇴화전후Cu호련선적직구화정계특정분포.Cu호련선균구유다중직구,기중(111)직구강도최고.침적태양품재실온하발생료자퇴화현상,병출현료일사이상장대적정립.수고관비강저화퇴화처리,Cu호련선정립척촌변대,(111)직구득도가강,이구유교저응변정도적직구여(111)직구강도적비례하강.침적태양품출현료(111)<112>화(111)<231>직구조분.퇴화후,출현료(111)<110>조분,이차(111)<112>화(111)<231>조분득도증강.Cu호련선이대각도정계위주,기중구유55°~60°착배각적정계화∑3정계비례최고,35°~40°적착배각화∑9정계차지.수고관비증가화퇴화처리,∑3정계비례축점승고,∑9정계비례하강.
Texture and grain boundary character distribution of Cu interconnects with different line width for as-deposited and annealed conditions were measured by EBSD. All specimens appear mixed texture and (111) texture is the dominate component. As-deposited interconnects undergo the phenomenon of self-annealing at RT,in which some abnormally large grains are found. Lower aspect ratio of lines and anneal treatment procured larger grains and stronger (111) texture.Meanwhile, the intensity proportion of other textures with lower strain energy to (111) texture is decreased. As-deposited specimens reveal (111) <112> and (111) <231> components. (111) <110> component appeared and (111) <112> and (111)<231> components were developed during the annealing process. High angle boundaries are dominant in all specimens,boundaries with a misorientation of 55°~60° and ∑3 ones in higher proportion, followed by lower boundaries with a mi-sorientation of 35°~ 40° and ∑9 boundaries. As the aspect ratio of lines and anneal treatment increase, there is a gradual in-crement in ∑3 boundaries and a decrease in ∑9 boundaries.