CAJ | 학술논문

以Ti_3AlC_2和Cu粉作为原料,在1150 ℃下原位热压反应制备了具有亚微米层状结构的Ti_3C_2/(Cu-Al)金属陶瓷材料.XRD、SEM和TEM分析表明,这种亚微米层状结构的形成,归因于Ti_3AlC_2与Cu的高温反应引发Ti_3AlC_2层状结构解离、Al原子溶脱,固溶入周围的Cu中形成Cu-Al固溶体,Al溶出后的Ti_3AlC_2中原始Ti_3C_2层规律性聚集、最终形成厚度为150 nm左右的Ti_3C_2层与Cu-Al层交替层叠结构.由于这两种结构之间的牢固结合以及Cu-Al相构成的空间网络结构,使得此金属陶瓷材料具有优异的力学性能和电学性能.其抗弯强度超过1200 MPa,并具有良好的断裂韧性和导电性.
이Ti_3AlC_2화Cu분작위원료,재1150 ℃하원위열압반응제비료구유아미미층상결구적Ti_3C_2/(Cu-Al)금속도자재료.XRD、SEM화TEM분석표명,저충아미미층상결구적형성,귀인우Ti_3AlC_2여Cu적고온반응인발Ti_3AlC_2층상결구해리、Al원자용탈,고용입주위적Cu중형성Cu-Al고용체,Al용출후적Ti_3AlC_2중원시Ti_3C_2층규률성취집、최종형성후도위150 nm좌우적Ti_3C_2층여Cu-Al층교체층첩결구.유우저량충결구지간적뢰고결합이급Cu-Al상구성적공간망락결구,사득차금속도자재료구유우이적역학성능화전학성능.기항만강도초과1200 MPa,병구유량호적단렬인성화도전성.
A sub-micro-layered Ti_3C_2/(Cu-Al) cermet was prepared by in-situ hot pressing a mixture of Ti_3AlC_2 and copper powders. The reaction behaviors and microstructures of the cermet were investigated by XRD, SEM and TEM. It was revealed that the molten Cu accelerated Ti_3AlC_2 to decompose, induced the interfacial exfoliation to generate, and consequently formed a sub-micro-layered structure making up of Ti_3C_2 layers and Cu-Al alloy layers within one Ti_3AlC_2 grain. This interfacial exfoliation behavior can be attributed to a topotactic mechanism due to the outward diffusion of Al and the entering of Cu. The removed Al atoms entered into Cu matrix to form Cu-Al alloy. Thus, a sub-micro-layered Ti_3C_2/(Cu-Al) cermet was fabricated. Both the widths of the Ti_3C_2 layer and Cu-Al layer were ～150 nm. The cermets have excellent mechanical and electrical properties, due to the strong interface bond between Ti_3C_2 layer and Cu-Al alloy layer. The flexural strength of the cermets with the original Ti_3AlC_2 volume content of 40%, 50% and 60% was as high as 1105.13, 1241.96 and 1229.06 MPa, respectively. Correspondingly, the fracture toughness was 15.91, 12.87 and 10.62 MPa.m~(1/2), respectively.